DIN EN IEC 61190-1-3:2018
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018

Standard No.

DIN EN IEC 61190-1-3:2018

Release Date

2018

Published By

German Institute for Standardization

Status

Be replaced

Replace By

DIN EN IEC 61190-1-3:2018-09

Latest

DIN EN IEC 61190-1-3:2018-09

Replace

DIN EN 61190-1-3:2011 DIN EN 61190-1-3:2015

Scope

This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders.

DIN EN IEC 61190-1-3:2018 Referenced Document

• IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
• IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board ass
• IEC 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods materials and assemblies - Soldering flux for printed board assemblies
• IEC 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
• IEC 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
• IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
• IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
• IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies
• IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
• IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly
• ISO 1073-1:1976 Alphanumeric character sets for optical recognition; Part 1: Character set OCR-A; Shapes and dimensions of the printed image
• ISO 9453:2014 Soft solder alloys - Chemical compositions and forms
• ISO 9454-1:2016 Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging
• ISO 9454-2:1998 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements

DIN EN IEC 61190-1-3:2018 history

• 2018 DIN EN IEC 61190-1-3:2018-09 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018 / Note: DIN...
• 2018 DIN EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018
• 0000 DIN EN 61190-1-3:2015
• 2011 DIN EN 61190-1-3:2011 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007 + A1:2010); German version EN 61190-1-3:2007 + A1:20
• 2007 DIN EN 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007); German version EN 61190-1-3:2007

DIN EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018 has been changed from DIN EN 61190-1-3:2011 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007 + A1:2010); German version EN 61190-1-3:2007 + A1:20.