IEC 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Standard No.

IEC 61189-5:2006

Release Date

2006

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 61189-5:2006

Replace

IEC 91/608/FDIS:2006

Scope

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

IEC 61189-5:2006 history

• 2006 IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies