IEC 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
- Standard No.
- IEC 61189-5-503:2017
- Release Date
- 2017
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 61189-5-503:2017
- Replace
- IEC 91/1433/FDIS:2017
- Scope
- This part of IEC 61189 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity cyclic test and an unsaturated pressurized vapour test (HAST).
IEC 61189-5-503:2017 Referenced Document
- IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
- IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
- IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
- IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
- IEC 60068-2-67:1995 Environmental testing - Part 2: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components
- IEC 60068-2-78:2012 Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
- IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
- IPC TM-650 2.6.14.1 Electrochemical Migration Resistance Test
- IPC TM-650 2.6.25 Conductive Anodic Filament (CAF) Resistance Test: X-Y Axis*， 2024-04-20 Update
IEC 61189-5-503:2017 history
- 2017 IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
