IEC 61189-5-2:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods materials and assemblies - Soldering flux for printed board assemblies

Standard No.

IEC 61189-5-2:2015

Release Date

2015

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 61189-5-2:2015

Replace

IEC 91/1210/FDIS:2014

Scope

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering flux based on the existing IEC 61189-5 and IEC 61189-6. In addition@ it includes test methods of soldering flux for lead free soldering.

IEC 61189-5-2:2015 Referenced Document

• IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
• IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies
• IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
• IEC 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
• ISO ISO IEC 27001-2013 cor2-2015 technical errata*， 2024-04-20 Update
• ISO 9455-10:2012 Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method
• ISO 9455-11:1991 Soft soldering fluxes; test methods; part 11: solubility of flux residues
• ISO 9455-13:1996 Soft soldering fluxes - Test methods - Part 13: Determination of flux spattering
• ISO 9455-14:1991 Soft soldering fluxes; test methods; part 14: assessment of tackiness of flux residues
• ISO 9455-1:1990 Soft soldering fluxes; test methods; part 1: determination of non-volatile matter, gravimetric method
• ISO 9455-2:1993 Soft soldering fluxes; test methods; part 2: determination of non-volatile matter, ebulliometric method
• ISO 9455-3:1992 Soft soldering fluxes; test methods; part 3: determination of acid value, potentiometric and visual titration methods
• ISO 9455-5:2014 Soft soldering fluxes - Test methods - Part 5: Copper mirror test
• ISO 9455-6:1995 Soft soldering fluxes - Test methods - Part 6: Determination and detection of halide (excluding fluoride) content
• ISO 9455-8:1991 Soft soldering fluxes; test methods; part 8: determination of zinc content
• ISO 9455-9:1993 Soft soldering fluxes; test methods; part 9: determination of ammonia content

IEC 61189-5-2:2015 history

• 2015 IEC 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods materials and assemblies - Soldering flux for printed board assemblies