IEC 61189-5-4:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
- Standard No.
- IEC 61189-5-4:2015
- Release Date
- 2015
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 61189-5-4:2015
- Replace
- IEC 91/1212/FDIS:2014
- Scope
- This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for solder alloys@ fluxed and non-fluxed solid wire@ based on existing IEC 61189-5 and IEC 61189-6. In addition@ it includes test methods for solder alloys@ fluxed and non-fluxed solid wire@ and for lead free soldering.
IEC 61189-5-4:2015 Referenced Document
- IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
- IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies
- IEC 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
IEC 61189-5-4:2015 history
- 2015 IEC 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
