DIN EN 61190-1-3:2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007); German version EN 61190-1-3:2007

Standard No.

DIN EN 61190-1-3:2007

Release Date

2007

Published By

German Institute for Standardization

Status

Be replaced 2011-04

Replace By

DIN EN 61190-1-3:2011

Latest

DIN EN IEC 61190-1-3:2018

DIN EN 61190-1-3 E:2015-05

DIN EN 61190-1-3:2007 history

• 2018 DIN EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018
• 2011 DIN EN 61190-1-3:2011 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007 + A1:2010); German version EN 61190-1-3:2007 + A1:20
• 2007 DIN EN 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007); German version EN 61190-1-3:2007