IEC 60068-2-58:2017
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Standard No.

IEC 60068-2-58:2017

Release Date

2017

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced 2017-08

Replace By

IEC 60068-2-58:2015/AMD1:2017

Latest

IEC 60068-2-58:2015/AMD1:2017

Scope

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This standard document provides procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems. The solder bath method is applicable to SMDs designed for flow soldering and SMDs designed for reflow soldering when the solder bath (dipping) method is appropriate. The reflow method is applicable to the SMD designed for reflow soldering, to determine the suitability of SMDs for reflow soldering and when the solder bath (dipping) method is not appropriate. The objective of this standard is to ensure solderability of component lead or termination. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. This standard covers tests Td1, Td2 and Td3 as listed below: Number of Td Test Method Td1 Solderability of terminations Method 1: Solder bath Method 2: Reflow Td2 Resistance to soldering heat Method 1: Solder bath Method 2: Reflow Td3 Dewetting and resistance to dissolution of metallization Method 1: Solder bath Method 2: Reflow NOTE 1 For specific components other test methods may exist. NOTE 2 Test Td does not apply to printed wiring board (PWB), see IEC 61189-3. NOTE 3 Specific through-hole devices (where the device supplier has specifically documented support for reflow soldering) are also included in this standard.

IEC 60068-2-58:2017 Referenced Document

• IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
• IEC 60068-2-20:2008 Environmental testing - Part 2: Tests - Test T: Test methods for soldeability and resistance to soldering heat of devices with leads
• IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
• IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
• IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly
• IEC 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
• IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
• IEC 61249-2-22:2005 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
• IEC 61249-2-35:2008 Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials; clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
• IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
• ISO 9454-2:1998 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements

IEC 60068-2-58:2017 history

• 2017 IEC 60068-2-58:2015/AMD1:2017 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• 2017 IEC 60068-2-58:2017 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• 2015 IEC 60068-2-58:2015 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• 2005 IEC 60068-2-58:2005 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• 2004 IEC 60068-2-58:2004 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• 1999 IEC 60068-2-58:1999 Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• 1989 IEC 60068-2-58:1989 Environmental testing; part 2: tests; test td: solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)