IEC 61191-2:2017
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
- Standard No.
- IEC 61191-2:2017
- Release Date
- 2017
- Published By
- International Electrotechnical Commission (IEC)
- Status
- 2017-01
- Replace By
- IEC 61191-2:2017/COR1:2019
- Latest
- IEC 61191-2:2017/COR1:2019
- Replace
- IEC 91/1386/CDV:2016 IEC 61191-2:2013
- Scope
- This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e. g. through- hole, chip mounting, terminal mounting, etc.).
IEC 61191-2:2017 Referenced Document
- IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
- IEC 61191-1:2013 Printed board assemblies.Part 1: Generic specification.Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61191-2:2017 history
- 2017 IEC 61191-2:2017/COR1:2019 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
- 2017 IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
- 2013 IEC 61191-2:2013 Printed board assemblies.Part 2: Sectional specification.Requirements for surface mount soldered assemblies
- 1998 IEC 61191-2:1998 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
