IEC 61191-1:2013 Printed board assemblies.Part 1: Generic specification.Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.
IEC 61191-1:2013 Referenced Document
IEC 60194 Printed board design, manufacture and assembly - Terms and definitions*， 2015-04-01 Update
IEC 60721-3-1 Classification of environmental conditions — Part 3-1: Classification of groups of environmental parameters and their severities — Storage*， 2018-02-23 Update
IEC 61188-1-1 Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
IEC 61189-1 Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
IEC 61189-3 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61190-1-1 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 61190-1-2 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly*， 2014-02-01 Update
IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*， 2017-12-13 Update
IEC 61191-2 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies*， 2017-01-01 Update
IEC 61191-3 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies*， 2017-05-01 Update
IEC 61191-4 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies*， 2017-06-30 Update
IEC 61249-8-8 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
IEC 61340-5-1 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements; Corrigendum 1*， 2017-05-01 Update
IEC 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide*， 2021-07-16 Update
IEC 61191-1:2013 history
0000 IEC 61191-1:2018 RLV
2013IEC 61191-1:2013 Printed board assemblies.Part 1: Generic specification.Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
1998IEC 61191-1:1998 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies