IEC 61191-3:2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Standard No.

IEC 61191-3:2017

Release Date

2017

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 61191-3:2017

Replace

IEC 91/1375/CDV:2016 IEC 61191-3:1998

Scope

This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

IEC 61191-3:2017 Referenced Document

• IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
• IEC 61191-1:2013 Printed board assemblies.Part 1: Generic specification.Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
• IPC A-610F-2014 Acceptability of Electronic Assemblies

IEC 61191-3:2017 history

• 2017 IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
• 1998 IEC 61191-3:1998 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies