IEC 61191-3:1998
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Standard No.

IEC 61191-3:1998

Release Date

1998

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced 2017-05

Replace By

IEC 61191-3:2017

Latest

IEC 61191-3:2017

Replace

IEC 91/133/FDIS:1998

Scope

This standard prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

IEC 61191-3:1998 history

• 2017 IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
• 1998 IEC 61191-3:1998 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies