IEC 61188-1-1:1997
Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
- Standard No.
- IEC 61188-1-1:1997
- Release Date
- 1997
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 61188-1-1:1997
- Replace
- IEC 52/721/FDIS:1997
- Scope
- This part of IEC 61188 describes those factors which control the flatness of rigid printed boards and their assemblies. The object of this standard is to inform the designer, manufacturer, assembler and user of rigid printed boards and their assemblies about those factors affecting their flatness. This standard incorporates advice regarding: - design (clause 3); - base material (clause 4); - unassembled printed boards (clause 5); - printed board assemblies (clause 6).
IEC 61188-1-1:1997 history
- 1997 IEC 61188-1-1:1997 Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
