IEC 60068-2-58:1999
Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- Standard No.
- IEC 60068-2-58:1999
- Release Date
- 1999
- Published By
- International Electrotechnical Commission (IEC)
- Status
- 2015-03
- Replace By
- IEC 60068-2-58:2004
- Latest
- IEC 60068-2-58:2015/AMD1:2017
IEC 60068-2-58:1999 history
- 2017 IEC 60068-2-58:2015/AMD1:2017 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- 2017 IEC 60068-2-58:2017 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- 2015 IEC 60068-2-58:2015 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- 2005 IEC 60068-2-58:2005 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- 2004 IEC 60068-2-58:2004 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- 1999 IEC 60068-2-58:1999 Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- 1989 IEC 60068-2-58:1989 Environmental testing; part 2: tests; test td: solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
