IEC 60068-2-58:2005
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- Standard No.
- IEC 60068-2-58:2005
- Release Date
- 2005
- Published By
- International Electrotechnical Commission (IEC)
- Status
- 2017-08
- Replace By
- IEC 60068-2-58:2015
- Latest
- IEC 60068-2-58:2015/AMD1:2017
- Replace
- IEC 91/447/FDIS:2004 IEC 60068-2-58:2004
- Scope
- This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This
IEC 60068-2-58:2005 history
- 2017 IEC 60068-2-58:2015/AMD1:2017 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- 2017 IEC 60068-2-58:2017 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- 2015 IEC 60068-2-58:2015 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- 2005 IEC 60068-2-58:2005 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- 2004 IEC 60068-2-58:2004 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- 1999 IEC 60068-2-58:1999 Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- 1989 IEC 60068-2-58:1989 Environmental testing; part 2: tests; test td: solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
