IEC 60068-2-20:2008 Environmental testing - Part 2: Tests - Test T: Test methods for soldeability and resistance to soldering heat of devices with leads
This part of IEC 60068 outlines Test T, applicable to devices with leads. Soldering tests for
surface mounting devices (SMD) are described in IEC 60068-2-58.
This standard provides procedures for determining the solderability and resistance to
soldering heat of devices in applications using solder alloys, which are eutectic or near
eutectic tin lead (Pb), or lead-free alloys.
The procedures in this standard include the solder bath method and soldering iron method.
The objective of this standard is to ensure that component lead or termination solderability
meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition,
test methods are provided to ensure that the component body can resist against the heat load
to which it is exposed during soldering.
NOTE Information about wetting time and wetting force can be obtained by test methods using a wetting balance.
See IEC 60068-2-54 (solder bath method) and IEC 60068-2-69 (solder bath and solder globule method for SMDs).
IEC 60068-2-20:2008 Referenced Document
IEC 60068-1 Environmental testing - Part 1: General and guidance*， 2013-10-01 Update
IEC 60068-2-2 Environmental testing - Part 2-2: Tests - Test B: Dry heat
IEC 60914 Conference systems - Electrical and audio requirements
IEC 61191-3 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies*， 2017-05-01 Update
IEC 61191-4 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies*， 2017-06-30 Update
IEC 60068-2-20:2008 history
0000 IEC 60068-2-20:2021 RLV
2008IEC 60068-2-20:2008 Environmental testing - Part 2: Tests - Test T: Test methods for soldeability and resistance to soldering heat of devices with leads
1970IEC 60068-2-20:1979/AMD2:1987 Amendment 2 - Basic environmental testing procedures - Part 2-20: Tests - Test T: Soldering
1970IEC 60068-2-20:1979/AMD1:1986 Amendment 1 - Basic environmental testing procedures - Part 2: Tests - Test T: Soldering
1979IEC 60068-2-20:1979 Environmental testing. Part 2: Tests. Test T: Soldering
1970IEC 60068-2-20:1968 Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test T: Soldering
1970IEC 60068-2-20:1960 Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test T: Soldering