GB/T 8750-2014
Gold bonding wire for semiconductor package (English Version)
- Standard No.
- GB/T 8750-2014
- Language
- Chinese, Available in English version
- Release Date
- 2014
- Published By
- General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
- Status
- 2023-07
- Replace By
- GB/T 8750-2022
- Latest
- GB/T 8750-2022
- Replace
- GB/T 8750-2007
- Scope
- This standard specifies the requirements, test methods, inspection rules, marking, packaging, transportation and storage, quality certificate, contract (or order form) for semiconductor discrete devices, integrated circuits, and bonding gold wire for LED packaging (hereinafter referred to as gold wire). and so on. This standard applies to bonding gold wires for semiconductor packaging.
GB/T 8750-2014 Referenced Document
- GB/T 10573 Tensile testing method for fine wire of nonferrous metals*， 2020-09-29 Update
- GB/T 11066.5 Methods for chemical analysis of gold.Determination of silver, copper, iron, lead , antimony and bismuth contents.Atomic emission spectrometry
- GB/T 15077 Geometric size measuring methods of precious metals and their alloy materials
GB/T 8750-2014 history
- 2022 GB/T 8750-2022 Gold-based bonding wire and bandlet for semiconductor package
- 2014 GB/T 8750-2014 Gold bonding wire for semiconductor package
- 2007 GB/T 8750-2007 Gold bonding wire for semiconductor devices
- 1997 GB/T 8750-1997 Gold wire for semiconductor devices lead bonding
