GB/T 8750-1997
Gold wire for semiconductor devices lead bonding (English Version)
- Standard No.
- GB/T 8750-1997
- Language
- Chinese, Available in English version
- Release Date
- 1997
- Published By
- General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
- Status
- 2008-06
- Replace By
- GB/T 8750-2007
- Latest
- GB/T 8750-2022
- Scope
- This standard specifies the product classification, requirements, test methods, testing rules and signs, packaging, transportation and storage of semiconductor device bonding gold wire. This standard applies to drawn or extruded gold wires used in semiconductor devices as internal leads.
GB/T 8750-1997 history
- 2022 GB/T 8750-2022 Gold-based bonding wire and bandlet for semiconductor package
- 2014 GB/T 8750-2014 Gold bonding wire for semiconductor package
- 2007 GB/T 8750-2007 Gold bonding wire for semiconductor devices
- 1997 GB/T 8750-1997 Gold wire for semiconductor devices lead bonding
