GB/T 8750-2022
Gold-based bonding wire and bandlet for semiconductor package (English Version)

Standard No.
GB/T 8750-2022
Language
Chinese, Available in English version
Release Date
2022
Published By
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest
GB/T 8750-2022
Replace
GB/T 8750-2014
Scope
This document specifies the classification and labeling, technical requirements, test methods, inspection rules, signs, packaging, transportation, storage, and accompanying documents and purchase orders (or contracts) of gold-based bonding wires and ribbons for semiconductor packaging. This document is applicable to gold-based bonding wires and ribbons for semiconductor discrete devices and integrated circuit packaging.

GB/T 8750-2022 Referenced Document

  • GB/T 10573 Tensile testing method for fine wire of nonferrous metals
  • GB/T 11066.5 Methods for chemical analysis of gold.Determination of silver, copper, iron, lead , antimony and bismuth contents.Atomic emission spectrometry
  • GB/T 15077 Geometric size measuring methods of precious metals and their alloy materials
  • GB/T 9288 Gold jewellery alloys—Determination of gold—Cupellation method (fire assay)
  • YS/T 938.4 Chemical analysis methods of gold alloys and palladium alloys for dental ceramic restoration.Part 4:Determination of gold,platinum,palladium,copper,tin, indium,zinc,gallium,beryllium, iron,manganese,lithium content.Inductively coupled plasma atomic emissi

GB/T 8750-2022 history

Gold-based bonding wire and bandlet for semiconductor package


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