GB/T 8750-2007
Gold bonding wire for semiconductor devices (English Version)
- Standard No.
- GB/T 8750-2007
- Language
- Chinese, Available in English version
- Release Date
- 2007
- Published By
- General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
- Status
- 2015-02
- Replace By
- GB/T 8750-2014
- Latest
- GB/T 8750-2022
- Replace
- GB/T 8750-1997
- Scope
- This standard specifies the requirements, test methods, inspection rules and signs, packaging, transportation and storage of semiconductor device bonding gold wire. This standard applies to drawn or extruded gold wires used in semiconductor devices as internal leads.
GB/T 8750-2007 history
- 2022 GB/T 8750-2022 Gold-based bonding wire and bandlet for semiconductor package
- 2014 GB/T 8750-2014 Gold bonding wire for semiconductor package
- 2007 GB/T 8750-2007 Gold bonding wire for semiconductor devices
- 1997 GB/T 8750-1997 Gold wire for semiconductor devices lead bonding
