BS EN 60068-2-69:2017+A1:2019 PDF

Scope: 1 Scope This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb).

BS EN 60068-2-69:2017+A1:2019 history

2019 BS EN 60068-2-69:2017+A1:2019 Environmental testing - Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
2017 BS EN 60068-2-69:2017 Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
2007 BS EN 60068-2-69:2007 Environmental testing - Tests - Test Te - Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
2006 BS EN 60068-2-54:2006 Environmental testing - Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
1996 BS EN 60068-2-69:1996 Environmental testing - Test methods - Tests - Test Te - Solderability testing of electronic components for surface mount technology by the wetting balance method
1989 BS 2011-2.1Ta:1989 Environmental testing - Tests - Test Ta - Soldering - Solderability testing by the wetting balance method