BS EN 60068-2-54:2006
Environmental testing - Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
- Standard No.
- BS EN 60068-2-54:2006
- Release Date
- 2006
- Published By
- British Standards Institution (BSI)
- Status
- 2017-07
- Replace By
- BS EN 60068-2-69:2017
- Latest
- BS EN 60068-2-69:2017
- Replace
- BS 2011-2.1Ta:1989
- Scope
- This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
BS EN 60068-2-54:2006 Referenced Document
- IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*， 2017-12-13 Update
BS EN 60068-2-54:2006 history
- 2017 BS EN 60068-2-69:2017 Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
- 2006 BS EN 60068-2-54:2006 Environmental testing - Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
- 1989 BS 2011-2.1Ta:1989 Environmental testing - Tests - Test Ta - Soldering - Solderability testing by the wetting balance method
