BS EN 60068-2-69:1996
Environmental testing - Test methods - Tests - Test Te - Solderability testing of electronic components for surface mount technology by the wetting balance method
- Standard No.
- BS EN 60068-2-69:1996
- Release Date
- 1996
- Published By
- British Standards Institution (BSI)
- Status
- 2007-07
- Replace By
- BS EN 60068-2-69:2007
- Latest
- BS EN 60068-2-69:2017+A1:2019
- Scope
- Describes the solder bath wetting balance and globule wetting balance methods of test. Both are applicable to components with metallic terminations and metallized solder pads. To be read in conjunction with BS EN 60068-1:1995
BS EN 60068-2-69:1996 history
- 2019 BS EN 60068-2-69:2017+A1:2019 Environmental testing - Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
- 2017 BS EN 60068-2-69:2017 Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
- 2007 BS EN 60068-2-69:2007 Environmental testing - Tests - Test Te - Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
- 1996 BS EN 60068-2-69:1996 Environmental testing - Test methods - Tests - Test Te - Solderability testing of electronic components for surface mount technology by the wetting balance method
