BS EN 60068-2-69:2007 PDF

Scope: This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

BS EN 60068-2-69:2007 Referenced Document

IEC 60068-1 Environmental testing - Part 1: General and guidance*， 2013-10-01 Update
ISO 6362 Wrought aluminium and aluminium alloys — Extruded rods/bars, tubes and profiles — Part 7: Chemical composition*， 2022-07-01 Update
ISO 683 Heat-treatable steels, alloy steels and free-cutting steels; part 9: wrought free-cutting steels

2019 BS EN 60068-2-69:2017+A1:2019 Environmental testing - Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
2017 BS EN 60068-2-69:2017 Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
2007 BS EN 60068-2-69:2007 Environmental testing - Tests - Test Te - Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
1996 BS EN 60068-2-69:1996 Environmental testing - Test methods - Tests - Test Te - Solderability testing of electronic components for surface mount technology by the wetting balance method