JIS C 60068-2-69:2019
Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

Standard No.

JIS C 60068-2-69:2019

Release Date

2019

Published By

Japanese Industrial Standards Committee (JISC)

Status

Be replaced

Replace By

JIS C 60068-2-69 AMD 1:2021

Latest

JIS C 60068-2-69 AMD 1:2021

Replace

JIS C 60068-2-69:2009 JIS C 60068-2-54:2009

JIS C 60068-2-69:2019 history

• 2021 JIS C 60068-2-69 AMD 1:2021 Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Amendment 1)
• 2019 JIS C 60068-2-69:2019 Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
• 2009 JIS C 60068-2-69:2009 Environmental testing -- Part 2-69: Tests -- Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
• 1996 JIS C 60068-2-54:1996 Environmental testing Part 2: tests. Test Ta: Soldering. Solderability testing by the wetting balance method