JIS C 60068-2-54:2009
Environmental testing -- Part 2-54: Tests -- Test Ta: Solderability testing of electronic components by the wetting balance method

Standard No.

JIS C 60068-2-54:2009

Release Date

2009

Published By

Japanese Industrial Standards Committee (JISC)

Status

Be replaced

Replace By

JIS C 60068-2-69:2019

Latest

JIS C 60068-2-69:2019

Replace

JIS C 60068-2-54:1996

Scope

This Standard outlines the solder bath wetting alance method applicable for any shape of component terminations to determine the solderability.

JIS C 60068-2-54:2009 Referenced Document

• JIS C 60068-1 Environmental testing -- Part 1: General and guidance*， 2016-04-20 Update
• JIS C 60068-2-20:1996 Basic environmental testing procedures Part 2: Tests. Test T: Soldering

JIS C 60068-2-54:2009 history

• 2019 JIS C 60068-2-69:2019 Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
• 2009 JIS C 60068-2-54:2009 Environmental testing -- Part 2-54: Tests -- Test Ta: Solderability testing of electronic components by the wetting balance method
• 1996 JIS C 60068-2-54:1996 Environmental testing Part 2: tests. Test Ta: Soldering. Solderability testing by the wetting balance method