The purpose of this standard is to determine the solderability of component terminals of arbitrary shapes. This test is particularly suitable as a reference test and for parts that cannot be tested quantitatively by other methods.
JIS C 60068-2-54:1996 history
2019JIS C 60068-2-69:2019 Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
2009JIS C 60068-2-54:2009 Environmental testing -- Part 2-54: Tests -- Test Ta: Solderability testing of electronic components by the wetting balance method
1996JIS C 60068-2-54:1996 Environmental testing Part 2: tests. Test Ta: Soldering. Solderability testing by the wetting balance method