ISO 16525-9:2014
Adhesives - Test methods for isotropic electrically conductive adhesives - Part 9: Determination of high-speed signal-transmission characteristics

Standard No.

ISO 16525-9:2014

Release Date

2014

Published By

International Organization for Standardization (ISO)

Latest

ISO 16525-9:2014

Scope

This part of ISO 16525 specifies test methods to investigate the high-speed signal-transmission characteristics in the bonded portions of an isotropic electrically conductive adhesive, which joins the terminals of a surface mounted device (SMD) and the land grid patterns of a printed circuit board. It also investigates the characteristics of wiring with an isotropic electrically conductive adhesive, which can be applied on the printed circuit board.

ISO 16525-9:2014 Referenced Document

• IEC 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
• IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations; Generic requirements
• IEC 61188-5-2:2003 Cartes imprimées et cartes imprimées équipées Conception et utilisation Partie 5-2: Considérations sur les liaisons pistes-soudures Composants discrets (Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987)
• IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
• IEC 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
• IEC 61188-5-5:2007 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
• IEC 61188-5-6:2003 Printed Boards and Printed Board Assemblies - Design and Use - Part 5-6: Attachment (Land/Joint) Considerations - Chip Carriers with J-Leads on Four Sides (Edition 1.0; Replaces IEC 60321 Ed. 1.0: 1970 and IEC 60321-2 Ed. 1.0: 1987)
• IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly
• IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
• IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
• IEC 61249-2-8:2003 Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad; Modified brominated epoxide woven fiberglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
• IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
• ISO 472:2013 Plastics - Vocabulary

ISO 16525-9:2014 history

• 2014 ISO 16525-9:2014 Adhesives - Test methods for isotropic electrically conductive adhesives - Part 9: Determination of high-speed signal-transmission characteristics