IEC 61188-5-3:2007
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
- Standard No.
- IEC 61188-5-3:2007
- Release Date
- 2007
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 61188-5-3:2007
- Replace
- IEC 91/702/FDIS:2007
- Scope
- This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design, and the land pattern dimensions.
IEC 61188-5-3:2007 history
- 2007 IEC 61188-5-3:2007 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
