IEC 61188-5-4:2007
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Standard No.

IEC 61188-5-4:2007

Release Date

2007

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 61188-5-4:2007

Replace

IEC 91/703/FDIS:2007

Scope

This part of IEC 61188 provides the component and land pattern dimensions for small outline integrated circuits with “J“ leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

IEC 61188-5-4:2007 history

• 2007 IEC 61188-5-4:2007 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides