JIS C 60068-2-83:2014
Environmental testing -- Part 2-83: Tests -- Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Standard No.

JIS C 60068-2-83:2014

Release Date

2014

Published By

Japanese Industrial Standards Committee (JISC)

Latest

JIS C 60068-2-83:2014

Replace

JIS C 0099:2005

JIS C 60068-2-83:2014 Referenced Document

• JIS C 5603 Terms and definitions for printed circuits
• JIS C 60068-1 Environmental testing -- Part 1: General and guidance*， 2016-04-20 Update
• JIS C 60068-2-20:2010 Environmental testing -- Part 2-20: Tests -- Test T: Test methods for solderability and resistance to soldering heat of devices with leads

JIS C 60068-2-83:2014 history

• 2014 JIS C 60068-2-83:2014 Environmental testing -- Part 2-83: Tests -- Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
• 2005 JIS C 0099:2005 Environmental testing: Tests -- Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste