JIS C 60068-2-20:2010
Environmental testing -- Part 2-20: Tests -- Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Standard No.

JIS C 60068-2-20:2010

Release Date

2010

Published By

Japanese Industrial Standards Committee (JISC)

Status

Be replaced 2022-09

Replace By

JIS C 60068-2-20:2022

Latest

JIS C 60068-2-20:2022

Replace

JIS C 60068-2-20:1996

Scope

This Standard outlines Test T,applicable to devices with leads. Soldering tests for aurface mounting devices (SMD)are described in JIS C60068-2-58.

JIS C 60068-2-20:2010 Referenced Document

• IEC 60194 Printed board design, manufacture and assembly - Terms and definitions*， 2015-04-01 Update
• JIS C 60068-1 Environmental testing -- Part 1: General and guidance*， 2016-04-20 Update
• JIS C 60068-2-2 Environmental testing -- Part 2-2 : Tests -- Test B: Dry heat
• JIS C 61191-3 Printed board assemblies -- Part 3: Sectional specification -- Requirements for through-hole mount soldered assemblies
• JIS C 61191-4 Printed board assemblies -- Part 4: Sectional specification -- Requirements for terminal soldered assemblies
• JIS K 5902 Colophonium
• JIS K 8101 Ethanol (99.5)
• JIS K 8839 2-Propanol (Reagent)

JIS C 60068-2-20:2010 history

• 2022 JIS C 60068-2-20:2022 Environmental testing -- Part 2-20: Tests -- Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
• 2010 JIS C 60068-2-20:2010 Environmental testing -- Part 2-20: Tests -- Test T: Test methods for solderability and resistance to soldering heat of devices with leads
• 1996 JIS C 60068-2-20:1996 Basic environmental testing procedures Part 2: Tests. Test T: Soldering