JIS C 0099:2005
Environmental testing: Tests -- Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste

Standard No.

JIS C 0099:2005

Release Date

2005

Published By

Japanese Industrial Standards Committee (JISC)

Status

Withdraw

Replace By

JIS C 60068-2-83:2014

Latest

JIS C 60068-2-83:2014

Scope

This standard specifies that lead-free solder paste (hereinafter referred to as solder paste) is applied to the metal terminals or electrodes of surface mount components (hereinafter referred to as SMD) mounted on printed wiring boards using a balanced method. Specifies the test method for evaluating solderability.

JIS C 0099:2005 history

• 2014 JIS C 60068-2-83:2014 Environmental testing -- Part 2-83: Tests -- Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
• 2005 JIS C 0099:2005 Environmental testing: Tests -- Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste