BS EN 61190-1-2:2014
Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly

Standard No.

BS EN 61190-1-2:2014

Release Date

2014

Published By

British Standards Institution (BSI)

Latest

BS EN 61190-1-2:2014

Replace

BS EN 61190-1-2:2007

BS EN 61190-1-2:2014 Referenced Document

• EN 60194 Printed board design, manufacture and assembly - Terms and definitions
• EN 61189-5-3 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies*， 2015-03-13 Update
• EN 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
• EN 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
• EN 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (Incorporates Amendment A1: 2010)
• EN ISO 9454-2 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:2020)*， 2020-10-31 Update
• IEC 60194 Printed board design, manufacture and assembly - Terms and definitions*， 2015-04-01 Update
• IEC 61189-5-3 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies*， 2015-01-01 Update
• IEC 61190-1-1 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
• IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*， 2017-12-13 Update
• ISO 9454-2 Soft soldering fluxes — Classification and requirements — Part 2: Performance requirements*， 2020-10-19 Update

BS EN 61190-1-2:2014 history

• 2014 BS EN 61190-1-2:2014 Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
• 2007 BS EN 61190-1-2:2007 Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
• 2002 BS EN 61190-1-2:2002 Attachment materials for electronic assembly - Requirements for solder pastes for high-quality interconnections in electronic assembly