EN 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (Incorporates Amendment A1: 2010)
European Committee for Electrotechnical Standardization(CENELEC)
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EN 61190-1-3:2007
EN 61190-1-3:2007 history
2007EN 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (Incorporates Amendment A1: 2010)
2002EN 61190-1-3:2002 Attachment Materials for Electronic Assembly Part 1-3: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications