EN 61190-1-3:2002
Attachment Materials for Electronic Assembly Part 1-3: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

Standard No.

EN 61190-1-3:2002

Release Date

2002

Published By

CENELEC - European Committee for Electrotechnical Standardization

Status

Be replaced

Replace By

EN 61190-1-3:2007

Latest

EN 61190-1-3:2007

EN 61190-1-3:2002 history

• 2007 EN 61190-1-3:2007 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (Incorporates Amendment A1: 2010)
• 2002 EN 61190-1-3:2002 Attachment Materials for Electronic Assembly Part 1-3: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications