BS EN 61190-1-2:2007 Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
This part of IEC 61190 specifies general requirements for the characterization and testing of
solder pastes used to make high-quality electronic interconnections in electronics assembly.
This standard serves as a quality control document and is not intended to relate directly to the
material's performance in the manufacturing process.
Related information on flux characterization, quality control and procurement documentation
for solder flux and flux containing material may be found in IEC 61190-1-1.
BS EN 61190-1-2:2007 history
2014BS EN 61190-1-2:2014 Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
2007BS EN 61190-1-2:2007 Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
2002BS EN 61190-1-2:2002 Attachment materials for electronic assembly - Requirements for solder pastes for high-quality interconnections in electronic assembly