GB/T 28859-2012
Encapsulating material of powdered epoxy for electronic components (English Version)

Standard No.
GB/T 28859-2012
Language
Chinese, Available in English version
Release Date
2012
Published By
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest
GB/T 28859-2012
Scope
This standard specifies the classification, technical requirements, inspection rules, inspection methods, packaging, marking, transportation and storage requirements of epoxy powder encapsulating materials for electronic components (hereinafter referred to as encapsulating materials). This standard applies to epoxy powder encapsulation materials for fluidized bed encapsulation of electronic components such as ceramic capacitors, varistors, film capacitors, resistor networks, and thermistors.

GB/T 28859-2012 Referenced Document

  • GB/T 10064-2006 Methods of test for the determination of the insulation resistance of solid insulating materials
  • GB/T 1034-2008 Plastics.Determination of water absorption
  • GB/T 1408.1-2006 Electrical strength of insulating materials-Test methods-Part 1:Tests at power frequencies
  • GB/T 1409-2006 Recommended methods for the determination of the permittivity and dielectric dissipation fator of electrical insulating materials at power,audio and radio frequencies including meter wavelengths
  • GB/T 1636-2008 Plastics.Determination of apparent density material that can be poured from a specified funnel
  • GB/T 21782.1-2008 Coating powders.part1: Determination of particle size distribution by sieving
  • GB/T 2411-2008 Plastics and ebonite.Determination of indentation hardness by means of a durometer(shore hardness)
  • GB/T 28858-2012 Encapsulating material of phenolic for electronic components
  • GB/T 28860-2012 Test method for the determination of get time of encapsulating material of powdered epoxy
  • GB/T 28861-2012 Test method for measuring melt fluidity of encapsulating material of powdered epoxy
  • GB/T 28862-2012 Method for processing sample of encapsulating material of powdered epoxy
  • GB/T 4722 Test methods for rigid copper clad laminates for printed circuits board*2017-05-31 Update
  • GB/T 5169.16-2008 Fire hazard testing for electric and electronic products.Part 16:Test flames.50W horizontal and vertical flame test methods
  • GB/T 6003.1-1997 Test sieves of metal wire cloth

GB/T 28859-2012 history

  • 2012 GB/T 28859-2012 Encapsulating material of powdered epoxy for electronic components
Encapsulating material of powdered epoxy for electronic components



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