GB/T 28858-2012
Encapsulating material of phenolic for electronic components (English Version)

Standard No.
GB/T 28858-2012
Language
Chinese, Available in English version
Release Date
2012
Published By
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest
GB/T 28858-2012
Scope
This standard specifies the classification, technical requirements, inspection rules, inspection methods, packaging, marking, storage and transportation of phenolic encapsulants for electronic components (hereinafter referred to as encapsulants). This standard applies to phenolic encapsulants for wet encapsulation of electronic components such as ceramic capacitors, pressure ceramic components, thermistors, and thick film circuits.

GB/T 28858-2012 Referenced Document

  • GB/T 10064-2006 Methods of test for the determination of the insulation resistance of solid insulating materials
  • GB/T 1408.1-2006 Electrical strength of insulating materials-Test methods-Part 1:Tests at power frequencies
  • GB/T 1409-2006 Recommended methods for the determination of the permittivity and dielectric dissipation fator of electrical insulating materials at power,audio and radio frequencies including meter wavelengths
  • GB/T 2411-2008 Plastics and ebonite.Determination of indentation hardness by means of a durometer(shore hardness)
  • GB/T 4722 Test methods for rigid copper clad laminates for printed circuits board*2017-05-31 Update
  • GB/T 6003.1-1997 Test sieves of metal wire cloth

GB/T 28858-2012 history

  • 2012 GB/T 28858-2012 Encapsulating material of phenolic for electronic components
Encapsulating material of phenolic for electronic components



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