This specification specifies the general requirements for the production and delivery of military semiconductor integrated circuit enclosures (hereinafter referred to as enclosures), as well as the quality and reliability assurance requirements that enclosures should meet. This specification applies to multilayer ceramic housings for semiconductor integrated circuits. The shell generally refers to the base.
GJB 1420B-2011 Referenced Document
GB/T 16526 The method measuring the lead-to-lead and loading capacitance of package leads
GB/T 7092 Outline dimensions of semiconductor integrated circuits*, 2021-03-09 Update
GJB 179A-1996 Counting sampling inspection procedures and tables
GJB 3014 Statistical process control system for electronic components
GJB 546 Reliability Guarantee Outline for Electronic Components
GJB 548 Microelectronic device test methods and procedures
SJ 20129 Methods for measurement of metallic coating thickness
SJ 20151 Specification for nickel strips for electron devices
YB/T 5231-2005 Sealed iron-nickel-cobalt alloy with permanent expansion
YB/T 5235-2005 Sealed iron-nickel-chromium, iron-nickel alloy with permanent expansion
GJB 1420B-2011 history
0000 GJB 1420B-2011(XG1-2015)
2011GJB 1420B-2011 General specification for packages of semiconductor integrated circuits
1999GJB 1420A-1999 General Specification for Semiconductor Integrated Circuit Enclosures
1992GJB 1420-1992 General specification for packages of semiconductor integrated circuits