GJB 1420B-2011
General specification for packages of semiconductor integrated circuits (English Version)

Standard No.
GJB 1420B-2011
Language
Chinese, Available in English version
Release Date
2011
Published By
Military Standard of the People's Republic of China-General Armament Department
Status
 2016-03
Replace By
GJB 1420B-2011(XG1-2015)
Latest
GJB 1420B-2011(XG1-2015)
Scope
This specification specifies the general requirements for the production and delivery of military semiconductor integrated circuit enclosures (hereinafter referred to as enclosures), as well as the quality and reliability assurance requirements that enclosures should meet. This specification applies to multilayer ceramic housings for semiconductor integrated circuits. The shell generally refers to the base.

GJB 1420B-2011 Referenced Document

  • GB/T 16526 The method measuring the lead-to-lead and loading capacitance of package leads
  • GB/T 7092 Outline dimensions of semiconductor integrated circuits*2021-03-09 Update
  • GJB 179A-1996 Counting sampling inspection procedures and tables
  • GJB 3014 Statistical process control system for electronic components
  • GJB 546 Reliability Guarantee Outline for Electronic Components
  • GJB 548 Microelectronic device test methods and procedures
  • SJ 20129 Methods for measurement of metallic coating thickness
  • SJ 20151 Specification for nickel strips for electron devices
  • YB/T 5231-2005 Sealed iron-nickel-cobalt alloy with permanent expansion
  • YB/T 5235-2005 Sealed iron-nickel-chromium, iron-nickel alloy with permanent expansion

GJB 1420B-2011 history

  • 0000 GJB 1420B-2011(XG1-2015)
  • 2011 GJB 1420B-2011 General specification for packages of semiconductor integrated circuits
  • 1999 GJB 1420A-1999 General Specification for Semiconductor Integrated Circuit Enclosures
  • 1992 GJB 1420-1992 General specification for packages of semiconductor integrated circuits
General specification for packages of semiconductor integrated circuits



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