BS EN 60191-6-12:2011 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended
variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.
BS EN 60191-6-12:2011 Referenced Document
IEC 60191 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
BS EN 60191-6-12:2011 history
2011BS EN 60191-6-12:2011 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
2002BS EN 60191-6-12:2002 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type