IEC 60191-6:2009
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
- Standard No.
- IEC 60191-6:2009
- Release Date
- 2009
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 60191-6:2009
- Replace
- IEC 47D/736/CDV:2009 IEC 60191-6:2004
- Scope
- This part of IEC 60191 gives general rules for the preparation of outline drawings of surfacemounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8@ as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4.
IEC 60191-6:2009 history
- 2009 IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
- 2004 IEC 60191-6:2004 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
- 1970 IEC 60191-6:1990/AMD1:1999 Amendment 1 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
- 1990 IEC 60191-6:1990 Mechanical standardization of semiconductor devices; part 6: general rules for the preparation of outline drawings of surface mounted semiconductor device packages
