IEC 60191-6:2004
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Standard No.

IEC 60191-6:2004

Release Date

2004

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced 2009-11

Replace By

IEC 60191-6:2009

Latest

IEC 60191-6:2009

Scope

Gives general rules for the preparation of outlines drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and 60191-3. It covers all surface-mounted discrete semiconductors devices as well as integrated circuits classified as form

IEC 60191-6:2004 history

• 2009 IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
• 2004 IEC 60191-6:2004 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
• 1970 IEC 60191-6:1990/AMD1:1999 Amendment 1 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
• 1990 IEC 60191-6:1990 Mechanical standardization of semiconductor devices; part 6: general rules for the preparation of outline drawings of surface mounted semiconductor device packages