BS EN 60191-6-12:2002 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
This part of IEC 60191 provides common outline drawings and dimensions for all types of
structures and composed materials of fine-pitch land grid array (hereinafter called FLGA)
whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is
rectangular.
BS EN 60191-6-12:2002 history
2011BS EN 60191-6-12:2011 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
2002BS EN 60191-6-12:2002 Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type