IEC 60191-6/AMD1:1999
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Amendment 1

Standard No.

IEC 60191-6/AMD1:1999

Release Date

1999

Published By

International Electrotechnical Commission (IEC)

Status

Be replaced 2009-11

Replace By

IEC 60191-6:2004

Latest

IEC 60191-6:2009

Replace

IEC 47D/170/CDV:1997 IEC 47D/320/FDIS:1999

IEC 60191-6/AMD1:1999 history

• 2009 IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
• 2004 IEC 60191-6:2004 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
• 1999 IEC 60191-6/AMD1:1999 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Amendment 1
• 1990 IEC 60191-6:1990 Mechanical standardization of semiconductor devices; part 6: general rules for the preparation of outline drawings of surface mounted semiconductor device packages

IEC 60191-6/AMD1:1999 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Amendment 1 was changed to IEC 60191-6:2004 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages.