ASTM F638-88(2001)
- Standard No.
- ASTM F638-88(2001)
- Release Date
- 1970
- Published By
- /
- Latest
- ASTM F638-88(2001)
- Scope
- Full Description 1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier. 1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.
ASTM F638-88(2001) Referenced Document
- ASTM F16 Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps*， 2006-02-01 Update
- ASTM F205 Standard Test Method for Measuring Diameter of Fine Wire by Weighing*， 2020-05-01 Update
- ASTM F219 Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps*， 2018-03-01 Update
- ASTM F584 Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire*， 1987-04-21 Update
- ASTM F72 Standard Specification for Gold Wire for Semiconductor Lead Bonding*， 1995-04-21 Update
ASTM F638-88(2001) history
- 1970 ASTM F638-88(2001)
- 2001 ASTM F638-88(1995)e1 Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding
