ASTM F584-87(2005)
Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire

Standard No.
ASTM F584-87(2005)
Release Date
1987
Published By
American Society for Testing and Materials (ASTM)
Status
Replace By
ASTM F584-06
Latest
ASTM F584-06e1
Scope

1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.

1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope.

1.3 Photographs (Figs. X1-X1.5 ) are included in Appendix X1 as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use.

ASTM F584-87(2005) history

  • 2006 ASTM F584-06e1 Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
  • 2006 ASTM F584-06 Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
  • 1987 ASTM F584-87(2005) Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
  • 1999 ASTM F584-87(1999) Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire



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