GB/T 26069-2022 (English Version) PDF

Scope: This document specifies the classification, technical requirements, test methods, inspection rules, packaging, marking, transportation, storage, accompanying documents and order form of silicon single crystal annealed wafers (hereinafter referred to as annealed wafers). This document is applicable to silicon wafers with a certain width of clean area formed on the surface of silicon single crystal polished wafers by annealing process, and the products are used in integrated circuits of technology generation 180nm~22nm.

GB/T 26069-2022 Referenced Document

GB/T 12962 Silicon single crystal
GB/T 12965 Monocrystalline silicon as cut wafers and lapped wafers
GB/T 14264 Semiconductor materials-Terms and definitions
GB/T 1550 Test methods for conductivity type of extrinsic semiconducting materials
GB/T 19921 Test method for particles on polished silicon wafer surfaces
GB/T 2828.1-2012 Inspection procedure by count sampling part 1: Lot by lot inspection sampling plan retrieved by acceptance quality limit (AQL)
GB/T 29507 Test method for measuring flatness,thickness and total thickness variation on silicon wafers.Automated non-contact scanning
GB/T 32280 Test method for warp and bow of silicon wafers—Automated non-contact scanning method
GB/T 39145 Test method for the content of surface metal elements on silicon wafers—Inductively coupled plasma mass spectrometry
GB/T 4058 Test method for detection of oxidation induced defects in polished silicon wafers
GB/T 6616 Non-contact eddy current method for testing semiconductor wafer resistivity and semiconductor film sheet resistance*， 2023-08-06 Update
GB/T 6624 Standard method for measuring the surface quality of polished silicon slices by visual inspection
YS/T 28 Wafer packaging
YS/T 679 Surface photovoltage method for measuring minority carrier diffusion length in extrinsic semiconductors