IEC 62435-5:2017
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices

Standard No.

IEC 62435-5:2017

Release Date

2017

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 62435-5:2017

Replace

IEC 47/2328/FDIS:2016

Scope

This part of IEC 62435, is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes. Typically, this part is used in conjunction with IEC 62435-1 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.

IEC 62435-5:2017 Referenced Document

• IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms

IEC 62435-5:2017 history

• 2017 IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices