IEC 61760-3:2021
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

Standard No.

IEC 61760-3:2021

Release Date

2021

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 61760-3:2021

Replace By

IEC 61760-3:2010 IEC 91/1684/FDIS:2020

Scope

This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology. The object of this document is t

IEC 61760-3:2021 history

• 2021 IEC 61760-3:2021 Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
• 2010 IEC 61760-3:2010 Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering