IEC 61760-3:2010 PDF

Scope: This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology.

IEC 61760-3:2010 Referenced Document

IEC 60062 Marking codes for resistors and capacitors CONSOLIDATED EDITION*， 2019-08-20 Update
IEC 60068 Basic climatic and mechanical robustness testing procedure for components
IEC 60068-2-45:1980 Environmental testing. Part 2: Tests. Test XA and guidance: Immersion in cleaning solvents
IEC 60194 Printed board design, manufacture and assembly - Terms and definitions*， 2015-04-01 Update
IEC 60286 Packaging of components for automatic handling
IEC 60286-3 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes*， 2022-11-15 Update
IEC 60286-4 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms*， 2013-07-01 Update
IEC 60286-5 Packaging of components for automatic handling - Part 5: Matrix trays*， 2018-04-25 Update
IEC 61760-2 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide*， 2021-07-16 Update
IEC 62090 Product package labels for electronic components using bar code and two-dimensional symbologies*， 2017-04-01 Update
ISO 8601 Data elements and interchange formats - Information interchange - Representation of dates and times

2021 IEC 61760-3:2021 Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
2010 IEC 61760-3:2010 Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering